Skip to main content
SinterWorks Logo
SinterWorks Technology
Consumer electronics heat sink application example using copper-infiltrated powder metallurgy
Case Study

PM Heat Sinks for Electronics Thermal Management

Copper-infiltrated powder metallurgy heat sinks for 5G electronics. 35% lighter, complex fin design, improved thermal performance.

Note: This page summarizes a representative application example. Results are specific to the described design, validation scope, and production conditions.

Executive Summary

Client: 5G telecommunications equipment manufacturer Challenge: Aluminum heat sinks insufficient for high-power RF modules Solution: Copper-infiltrated PM heat sinks with complex fin arrays Results:

  • Thermal resistance reduced 28% (0.45 deg C/W to 0.32 deg C/W)
  • Weight reduced 35% vs solid copper (infiltrated structure)
  • Complex fin geometry (120 fins, 1mm spacing)
  • Cost: 15% lower than CNC machined copper

Customer Background

Industry: 5G telecommunications infrastructure Application: High-power RF amplifier cooling (200W heat load) Environment: Outdoor base stations (-40 deg C to +65 deg C ambient) Challenge: Limited space, high thermal density


The Challenge

Problem 1: Thermal Performance

  • Issue: Aluminum heat sinks: 0.45 deg C/W thermal resistance
  • Requirement: <0.35 deg C/W to prevent RF power de-rating
  • Impact: Reduced transmission power in hot climates

Problem 2: Manufacturing Limitations

  • Issue: CNC milling 120 fine copper fins prohibitively expensive
  • Cost: $85 per heat sink
  • Lead Time: 6-8 weeks

Problem 3: Weight

  • Issue: Solid copper heat sink weighs 1.2 kg
  • Impact: Structural support costs, installation challenges

SinterWorks PM Solution

Material: Copper-Infiltrated Iron (FLC-4608)

Why Copper-Infiltrated?

  • Thermal conductivity: 180-220 W/mK (vs Al 205 W/mK, Cu 400 W/mK)
  • Lighter than solid copper (controlled porosity, copper infiltration)
  • Enables complex fin arrays impossible with machining

Manufacturing Process

  1. Iron Skeleton Compaction: Complex tooling with 120 fin cores
  2. Pre-Sinter: 1100 deg C
  3. Copper Infiltration: 1150 deg C (copper slug melts, fills pores)
  4. Final Density: 7.2-7.4 g/cm3 (vs 8.9 g/cm3 solid copper)
  5. CNC Flatness: Bottom mounting surface machined to +/-0.02mm

Design Features

  • Fin Count: 120 fins
  • Fin Spacing: 1.0mm
  • Fin Height: 35mm
  • Base Thickness: 8mm
  • Mounting Holes: 4x M4 threaded (sintered threads)

Results

Thermal Performance

MetricAluminumPM Copper-InfiltratedImprovement
Thermal Resistance0.45 deg C/W0.32 deg C/W-28%
Junction Temp (200W)115 deg C94 deg C-21 deg C
Max Power (85 deg C limit)165W245W+48%

Weight & Cost

  • Weight: 780g (vs 1200g solid copper, 450g aluminum)
  • Cost: $72 (vs $85 machined copper, $35 aluminum)
  • ROI: Increased RF power output justified 2x aluminum cost

Get PM Heat Sinks for Electronics

SinterWorks manufactures advanced PM heat sinks:

  • Copper-infiltrated, aluminum, or custom alloys
  • Complex fin geometries (pin fins, radial fins)
  • Thermal testing and simulation support
  • Volumes: 5K to 200K parts/year

Need Help Reviewing a PM Thermal Management Part?

We can review heat load, fin geometry, flatness requirements, and production volume to judge whether a PM heat sink route fits your electronics program.

  • DFM review support
  • Material and process guidance
  • Quotation feedback within 24-48 hours