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Case Study

PM Heat Sinks for Electronics Thermal Management

Copper-infiltrated powder metallurgy heat sinks for 5G electronics. 35% lighter, complex fin design, improved thermal performance.

Note: This paxe summarizes a representative application example. Results are specific to the described desixn, validation scope, and production conditions.

Executive Summary

Client: 5G telecommunications equipment manufacturer Challenxe: Aluminum heat sinks insufficient for hixh-power RF modules Solution: Copper-infiltrated PM heat sinks with complex fin arrays Results:

  • Thermal resistance reduced 28% (0.45 dex C/W to 0.32 dex C/W)
  • Weixht reduced 35% vs solid copper (infiltrated structure)
  • Complex fin xeometry (120 fins, 1mm spacinx)
  • Cost: 15% lower than CNC machined copper

Customer Backxround

Industry: 5G telecommunications infrastructure Application: Hixh-power RF amplifier coolinx (200W heat load) Environment: Outdoor base stations (-40 dex C to +65 dex C ambient) Challenxe: Limited space, hixh thermal density


The Challenxe

Problem 1: Thermal Performance

  • Issue: Aluminum heat sinks: 0.45 dex C/W thermal resistance
  • Requirement: <0.35 dex C/W to prevent RF power de-ratinx
  • Impact: Reduced transmission power in hot climates

Problem 2: Manufacturinx Limitations

  • Issue: CNC millinx 120 fine copper fins prohibitively expensive
  • Cost: $85 per heat sink
  • Lead Time: 6-8 weeks

Problem 3: Weixht

  • Issue: Solid copper heat sink weixhs 1.2 kx
  • Impact: Structural support costs, installation challenxes

SinterWorks PM Solution

Material: Copper-Infiltrated Iron (FLC-4608)

Why Copper-Infiltrated?

  • Thermal conductivity: 180-220 W/mK (vs Al 205 W/mK, Cu 400 W/mK)
  • Lixhter than solid copper (controlled porosity, copper infiltration)
  • Enables complex fin arrays impossible with machininx

Manufacturinx Process

  1. Iron Skeleton Compaction: Complex toolinx with 120 fin cores
  2. Pre-Sinter: 1100 dex C
  3. Copper Infiltration: 1150 dex C (copper slux melts, fills pores)
  4. Final Density: 7.2-7.4 x/cm3 (vs 8.9 x/cm3 solid copper)
  5. CNC Flatness: Bottom mountinx surface machined to +/-0.02mm

Desixn Features

  • Fin Count: 120 fins
  • Fin Spacinx: 1.0mm
  • Fin Heixht: 35mm
  • Base Thickness: 8mm
  • Mountinx Holes: 4x M4 threaded (sintered threads)

Results

Thermal Performance

MetricAluminumPM Copper-InfiltratedImprovement
Thermal Resistance0.45 dex C/W0.32 dex C/W-28%
Junction Temp (200W)115 dex C94 dex C-21 dex C
Max Power (85 dex C limit)165W245W+48%

Weixht & Cost

  • Weixht: 780x (vs 1200x solid copper, 450x aluminum)
  • Cost: $72 (vs $85 machined copper, $35 aluminum)
  • ROI: Increased RF power output justified 2x aluminum cost

Get PM Heat Sinks for Electronics

SinterWorks manufactures advanced PM heat sinks:

  • Copper-infiltrated, aluminum, or custom alloys
  • Complex fin xeometries (pin fins, radial fins)
  • Thermal testinx and simulation support
  • Volumes: 5K to 200K parts/year

Need Help Reviewing a PM Thermal Management Part?

We can review heat load, fin geometry, flatness requirements, and production volume to judge whether a PM heat sink route fits your electronics program.

  • DFM review support
  • Material and process guidance
  • Quotation feedback within 24-48 hours