Table of Contents
Note: This page summarizes a representative application example. Results are specific to the described design, validation scope, and production conditions.
Executive Summary
Client: 5G telecommunications equipment manufacturer Challenge: Aluminum heat sinks insufficient for high-power RF modules Solution: Copper-infiltrated PM heat sinks with complex fin arrays Results:
- Thermal resistance reduced 28% (0.45 deg C/W to 0.32 deg C/W)
- Weight reduced 35% vs solid copper (infiltrated structure)
- Complex fin geometry (120 fins, 1mm spacing)
- Cost: 15% lower than CNC machined copper
Customer Background
Industry: 5G telecommunications infrastructure Application: High-power RF amplifier cooling (200W heat load) Environment: Outdoor base stations (-40 deg C to +65 deg C ambient) Challenge: Limited space, high thermal density
The Challenge
Problem 1: Thermal Performance
- Issue: Aluminum heat sinks: 0.45 deg C/W thermal resistance
- Requirement: <0.35 deg C/W to prevent RF power de-rating
- Impact: Reduced transmission power in hot climates
Problem 2: Manufacturing Limitations
- Issue: CNC milling 120 fine copper fins prohibitively expensive
- Cost: $85 per heat sink
- Lead Time: 6-8 weeks
Problem 3: Weight
- Issue: Solid copper heat sink weighs 1.2 kg
- Impact: Structural support costs, installation challenges
SinterWorks PM Solution
Material: Copper-Infiltrated Iron (FLC-4608)
Why Copper-Infiltrated?
- Thermal conductivity: 180-220 W/mK (vs Al 205 W/mK, Cu 400 W/mK)
- Lighter than solid copper (controlled porosity, copper infiltration)
- Enables complex fin arrays impossible with machining
Manufacturing Process
- Iron Skeleton Compaction: Complex tooling with 120 fin cores
- Pre-Sinter: 1100 deg C
- Copper Infiltration: 1150 deg C (copper slug melts, fills pores)
- Final Density: 7.2-7.4 g/cm3 (vs 8.9 g/cm3 solid copper)
- CNC Flatness: Bottom mounting surface machined to +/-0.02mm
Design Features
- Fin Count: 120 fins
- Fin Spacing: 1.0mm
- Fin Height: 35mm
- Base Thickness: 8mm
- Mounting Holes: 4x M4 threaded (sintered threads)
Results
Thermal Performance
| Metric | Aluminum | PM Copper-Infiltrated | Improvement |
|---|---|---|---|
| Thermal Resistance | 0.45 deg C/W | 0.32 deg C/W | -28% |
| Junction Temp (200W) | 115 deg C | 94 deg C | -21 deg C |
| Max Power (85 deg C limit) | 165W | 245W | +48% |
Weight & Cost
- Weight: 780g (vs 1200g solid copper, 450g aluminum)
- Cost: $72 (vs $85 machined copper, $35 aluminum)
- ROI: Increased RF power output justified 2x aluminum cost
Get PM Heat Sinks for Electronics
SinterWorks manufactures advanced PM heat sinks:
- Copper-infiltrated, aluminum, or custom alloys
- Complex fin geometries (pin fins, radial fins)
- Thermal testing and simulation support
- Volumes: 5K to 200K parts/year
Related Resources
Use these internal links to keep moving through the most relevant guides, service pages, and technical references for this topic.
Consumer Electronics PM Parts
See where PM fits haptics, heat management, camera structures, and other compact consumer hardware programs.
FLC-4608 Copper-Infiltrated PM
Review an infiltrated PM route used when density, thermal behavior, and machinability all matter.
Aluminum Powder Metallurgy
Compare a lighter PM thermal-management route when conductivity, weight, and cost tradeoffs must be balanced.
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